リペアコンディショナー Amika The Kure Bond Repair Conditioner

Water/Eau/Aqua, Cetearyl Alcohol, Behentrimonium Chloride*, Silicone Quaternium-8, Butyrospermum Parkii (Shea/Karite) Butter, Glycerin, Trideceth-10, Hippophae Rhamnoides (Sea Buckthorn/Argousier) Fruit/Seed Oil, Capryloyl Glycerin/Sebacic Acid Copolymer, Diheptyl Succinate, Isopropyl Alcohol, Cocamide Mipa, Polyquaternium-37, Caprylyl Glycol, Propylene Glycol Dicaprylate/Dicaprate, Ethylhexylglycerin, Hexylene Glycol, Ppg-1 Trideceth-6, Citric Acid, Sodium Hydroxide, Phenoxyethanol, Fragrance/Parfum, Benzyl Benzoate, Isopropanolamine, Hydroxycitronellal, Limonene, Citronellol, Coumarin, Geraniol *Antistatic Agent/Agent Antistatique.